Exothermic resin
We solve the heat problem generated by the substrate and motor with heat dissipation resin!
We solve the heat issues generated by circuit boards and motors with heat-dissipating resin for developers of automotive parts manufacturers. This lowers the coil temperature and enables long-term operation. Additionally, it improves heat dissipation, allowing for higher integration of components on the circuit board. 【Features】 ■ Heat Damage Countermeasures - Prevents overheating through the heat dissipation effect of resin sealing on motors. ■ Miniaturization - Achieves miniaturization and higher integration with a 15°C temperature reduction through resin sealing on reactors. ■ Weight Reduction - Eliminates the need for heat sinks and passes reliability tests by sealing the circuit board with resin. *For more details, please download the PDF or contact us.
- 企業：高木化学研究所
- 価格：Other
